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| Capabilities | Flex | Rigid/Hybrid Rigid |
|---|---|---|
| Max. Layer Count | 6L - Mass production >6L Low volume |
6L - Mass production >6L Low volume |
| Max. Working panel size, Inches. | 23”x29” | 18”x24” |
| Min Circuit Width/Spacing | 5/5 mil - Mass production 4/4 mil - Low volume |
5/5 mil - Mass production 4/4 mil - Low volume |
| Base material Types | Polyimide PET PEN PI/PEP |
FR-4,Tg130°C, 150°C FR-4,Tg180°C PTFE 185HR/370HR |
| Min. board thickness | 0.13mm | 0.2mm |
| Surface Insulation coating | Coverlay/ Soldermask | Soldermask |
| Soldermask colors | Green Black White |
Green Black White Blue |
| Legend/Silkscreen printing | Min. Line Width: 6mil(0.152mm) Min. text height : 40mil(1mm) |
Min. Line Width: 6mil(0.152mm) Min. text height : 40mil(1mm) |
| Max. board thickness | 0.5mm | 3.2mm -DS 1.8mm -MLB 6.0mm - Antenna PCB |
| Min. Mech. Hole dia. | 8 mil (0.2mm) | 8 mil (0.2mm) |
| Min. Finished Hole Size | 6 mil (0.15mm) | 6 mil (0.15mm) |
| PTH hole dimensional Tol. | ± 3 mil (±0.075mm) | ± 3 mil (±0.075mm) |
| NPTH hole dimensional Tol. | ± 2 mil (±0.050mm) | ± 2 mil (±0.050mm) |
| Board dimensional Tol. | ± 4 mil (±0.1mm) | ± 4 mil (±0.1mm) |
| Aspect Ratio | NA. | 10:1 |
| Max Finished Copper Thickness | Inner-1OZ Outer-2OZ Single side - 7OZ Double side - 3OZ |
Inner-1OZ Outer-2OZ |
| Edge plating | YES | YES |
| Castellated plated Holes | YES | YES |
| Impedance board fab. Technology | YES | YES |
| Impedance tolerance | ±10% | ±10% |
| Heat sink bonding with Rogers TECA film | NA. | YES |
| Stiffener bonding | FR4 & SS | NA. |
| Final Finishes | ||
| HASL(Lead based) | YES | YES |
| Immersion Tin | YES | YES |
| ENIG | YES | YES |
| Immersion Silver | YES | YES |
| Direct gold | YES | YES |
MINIMUM REQUIREMENT FOR THE COPPER FEATURES:
| Layer | Finish copper thickness | Minimum trace width in mil | Minimum spacing in mil | Minimum annular ring in mil |
|---|---|---|---|---|
| Inner layer | 18µm / 0.5oz | 4 | 4 | 6mil |
| 35µm / 1oz | 4 | 4 | 6mil | |
| 70µm / 2oz | 6 | 6 | 7mil | |
| 105µm / 3oz | 8 | 8 | 9mil | |
| Outer layer | 18µm / 0.5oz | 4 | 4 | 6mil for Vias / 8mil for component holes |
| 35µm / 1oz | 5 | 5 | 6mil for vias, 8mil for component holes | |
| 70µm / 2oz | 7 | 7 | 8mil for vias, 9mil for component holes | |
| 105µm / 3oz | 9 | 9.5 | 9mil for vias, 11mil for component holes |